7 records found
1
Mechanics of Microelectronics
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
Virtual qualification of moisture induced failures of advanced packages
Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
Cracking prediction of IC's passivation layer using J-integral
The influence of leadframe on passivation cracks growth
A micro-mechanics approach for polymeric material failures in microelectronic packaging