7 records found
1
Mechanics of Microelectronics
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
Virtual qualification of moisture induced failures of advanced packages
The influence of leadframe on passivation cracks growth
Cracking prediction of IC's passivation layer using J-integral
A micro-mechanics approach for polymeric material failures in microelectronic packaging
