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XJ Fan
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7 records found
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
Journal article -
XJ Fan
,
J Zhou
,
Kouchi Zhang
,
L.J. Ernst
Mechanics of Microelectronics
Book -
Kouchi Zhang
,
W.D. van Driel
,
XJ Fan
Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
Conference paper -
D Yang
,
K.M.B. Jansen
,
L.J. Ernst
,
GQ Zhang
,
WD van Driel
,
HJL Bressers
,
XJ Fan
A micro-mechanics approach for polymeric material failures in microelectronic packaging
Conference paper -
XJ Fan
,
GQ Zhang
,
L.J. Ernst
Cracking prediction of IC's passivation layer using J-integral
Conference paper -
GQ Zhang
,
WD van Driel
,
XJ Fan
,
L.J. Ernst
Virtual qualification of moisture induced failures of advanced packages
Conference paper -
MAJ van Gils
,
WD van Driel
,
GQ Zhang
,
HJL Bressers
,
RBR van Silfhout
,
XJ Fan
,
JHJ Jansen
The influence of leadframe on passivation cracks growth
Conference paper -
GQ Zhang
,
WD van Driel
,
XJ Fan
,
L.J. Ernst