Cv
C van t Hof
Authored
20 records found
In order to calculate cure induced stresses, reliable material data is needed over a large modulus range. This paper concerns the derivation of correction equations needed for the interpretation of dynamic mechanical experiments on two different shear tools. For the first shear t
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In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the
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Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the in
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