Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Advanced structural similarity rules for the BGA package family

From chemical building blocks of polymers to microelectronics reliability

Mechanism-based delamination prediction during reflow with moisture preconditioning

Virtual qualification of moisture induced failures of advanced packages

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Virtual prototyping and qualification of Board Level Assembly

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

Modeling of cure-induced warpage of plastic IC packages

Prediction of thermo-mechanical integrity of wafer backend processes

Prediction of crack growth in IC passivation layers

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

On wire failures in micro-electronic packages

Fully cure-dependent polymer modeling and application to QFN-packages warpage

Effect of delamination of IC/compound interface on passivation cracking

Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

Prediction and verification of process induced warpage of electronic packages

Response surface modeling for nonlinear packaging stresses

Cracking prediction of IC's passivation layer using J-integral

Prediction of crack growth in IC passivation layers