Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Advanced structural similarity rules for the BGA package family

Fully cure-dependent polymer modeling and application to QFN-packages warpage

Virtual qualification of moisture induced failures of advanced packages

Modeling of cure-induced warpage of plastic IC packages

Virtual prototyping and qualification of Board Level Assembly

Prediction of thermo-mechanical integrity of wafer backend processes

Mechanism-based delamination prediction during reflow with moisture preconditioning

From chemical building blocks of polymers to microelectronics reliability

On wire failures in micro-electronic packages

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Prediction of crack growth in IC passivation layers

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

The influence of leadframe on passivation cracks growth

Prediction of crack growth in IC passivation layers

Cracking prediction of IC's passivation layer using J-integral

Influence of material combinations on delamination failures in a cavity down TBGA package