Prediction and verification of process induced warpage of electronic packages

van Driel, WD; Zhang, GQ; Janssen, JHJ; Ernst, LJ; Su, F; Chian, KS; Yi, S

Prediction and verification of process induced warpage of electronic packages

Journal article (2003)

Authors

WD van Driel External organisation

GQ Zhang External organisation

JHJ Janssen External organisation

LJ Ernst Dynamics of Micro and Nano Systems

F Su External organisation

KS Chian External organisation

S Yi External organisation

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2003

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Research Group

Dynamics of Micro and Nano Systems

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