Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

Conference paper (2011)

Authors

M. Sadeghi Nia Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
G. Schlottig Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
H Pape External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2011

Language

English

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture and mode mixity. This work deals with the fracture
toughness measurements of an EMC-Cu lead frame interface under pressure cooker conditions ( >100 oC & 100% RH). To deal with it, a chamber with high pressure,
i.e. pressure cooker or pressure vessel, is needed. A mixed mode bending setup is installed in the pressure chamber. This will make it possible to have a prescribed opening
displacement under combined mode I/ II conditions on a bi-material specimen.