Ultra-thin deformable silicon substrates with lateral segmentation and flexible metal interconnect

Journal article (2007)

Authors

T. Zoumpoulidis Old - EWI Ch. Integrated Sensing Devices
L WANG Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
M. Bartek Old - EWI Ch. Integrated Sensing Devices
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Old - EWI Ch. Integrated Sensing Devices
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Published Date

2007

Language

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Research Group

Old - EWI Ch. Integrated Sensing Devices