Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger
Conference Paper
(2009)
Author(s)
F. Santagata (TU Delft - Electronic Components, Technology and Materials)
L. Mele (TU Delft - Electronic Components, Technology and Materials)
M. Mihailovic (TU Delft - Electronic Components, Technology and Materials)
Bruno Morana (TU Delft - Electronic Components, Technology and Materials)
J.F. Creemer (TU Delft - Electronic Components, Technology and Materials)
Pasqualina M Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:c16e6cb4-f70c-4511-840a-74b735d5042f
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Publication Year
2009
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
799-802
ISBN (print)
978-1-4244-5225-1
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