Influence of the passivation material on Stress voiding in AI-Cu alloys.
Journal Article
(2000)
Author(s)
JP Lokker (TU Delft - QN/Fysics of NanoElectronics)
G.C.A.M. Janssen (TU Delft - OLD Metals Processing, Microstructures and Properties)
S Radelaar (TU Delft - OLD Metals Processing, Microstructures and Properties)
Research Group
QN/Fysics of NanoElectronics
To reference this document use:
https://resolver.tudelft.nl/uuid:c4f93a33-f027-4dec-ac5b-90638091aead
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Publication Year
2000
Research Group
QN/Fysics of NanoElectronics
Issue number
2000
Volume number
50
Pages (from-to)
257-260
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