Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
Conference Paper
(2003)
Author(s)
P Mendes (TU Delft - Electronic Components, Technology and Materials)
A Polyakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
J.H. Correia (External organisation)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:d1064d81-810d-44be-88ab-c0d0adf8eff5
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Publication Year
2003
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
77-80
ISBN (print)
90-808266-1-8
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