Micromachining for Advanced Terahertz
Interconnects and Packaging Techniques at Terahertz Frequencies
Maria Alonso-del Pino (California Institute of Technology, TU Delft - Tera-Hertz Sensing)
C. Jung-Kubiak (California Institute of Technology)
Theodore Reck (Virginia Diodes Inc.)
Choonsup Lee (California Institute of Technology)
G. Chattopadhyay (Virginia Diodes Inc.)
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Abstract
It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.
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