Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

Conference paper (2022)

Authors

Xiao Li Fudan University
Jiuyang Tang Fudan University
Jiayan Zhao Mazo Technology Company Limited
Jinbing Li Mazo Technology Company Limited
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Pan Liu Fudan University
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2022 Xiao Li, Jiuyang Tang, Jiayan Zhao, Jinbing Li, Kouchi Zhang, Pan Liu
DOI: https://doi.org/10.1109/ICEPT56209.2022.9873343
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Published Date

2022

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a method of using Soft Magnetic Powder filled Epoxy (SMPE) adhesive as a molding material to encapsulate a power module, which is a DC/DC buck converter power module contains several passive components, 1 power inductor, and a high-efficiency switching regulator with two integrated N-channel MOSFETs. On the basis of Finite Element Method (FEM), models were firstly established with component level moldings and checked with actual module samples for calibration. Based on the calibrated model, inductors without component level molding were then simulated. SMPE with 4~7μm insulated carbonyl ferrous powder were prepared and measured the magnetic relative permeability. Such material was investigated to pot the whole power module as a one-step molding, instead of separate molding for the power inductor and the power module. After that, thermal analysis and inductance were calculated and compared.

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