A Micro-Power Temperature-to-Digital Converter for Use in a MEMS-Based 32 kHz Oscillator

Conference Paper (2015)
Author(s)

S Zaliasl (SiTime Corporation)

J Salvia (SiTime Corporation)

T Fiez (Oregon State University)

Kofi AA Kofi (TU Delft - Electronic Instrumentation)

A Partridge (SiTime Corporation)

V Menon (SiTime Corporation)

Research Group
Electronic Instrumentation
DOI related publication
https://doi.org/10.1007/978-3-319-21185-5_4
More Info
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Publication Year
2015
Language
English
Research Group
Electronic Instrumentation
Volume number
1
Pages (from-to)
65-79
ISBN (print)
978-3-319-21184-8
ISBN (electronic)
978-3-319-21185-5

Abstract

This paper describes the design of a low-power energy-efficient temperature-to-digital converter (TDC) intended for the temperature compensation of a 32 kHz MEMS-based oscillator (TCXO). The compensation scheme enables a frequency stability of ±3 ppm over temperatures ranging from −40 to 85 °C. The TDC consists of an NPN-based temperature sensing element and a 15-bit second order ΔΣ modulator. A novel dynamic element matching (DEM) scheme ensures that DEM tones do not inter-modulate with the modulator’s bit-stream, thus improving the TDC’s accuracy without impacting its resolution. The TDC occupies 0.085 mm2 in a 180 nm CMOS process, draws less than 4.5 μA from a 1.5 to 3.3 V supply, and achieves a resolution of 25 mK in a conversion time of 6 ms. This corresponds to a figure of merit of 24 pJ°C2.

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