Wafer-level PECVD sic micropackaging technology for MEMS devices
Conference Paper
(2009)
Author(s)
V Rajaraman (TU Delft - Electronic Instrumentation)
Paddy French (TU Delft - Electronic Instrumentation)
Research Group
Electronic Instrumentation
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https://resolver.tudelft.nl/uuid:e8669b52-2417-43c8-a842-a5014666b229
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Publication Year
2009
Research Group
Electronic Instrumentation
Pages (from-to)
1-4
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