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V. Rajaraman

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20 records found

SOG fabrication of bulk micromachined and bonded capacitive inertial sensor structures (U_SP_2_I_IC_T)

Two types of silicon biomimetics MEMS gyroscopes

DRIE assisted HAR MEMS processing of inertial sensors and actuators

Fabrication of a SOG-MEMS vibratory gyroscope by deep RIE technology and bonding (U_SP_2_I_IC_T)

A thin-SOI micromachined quasi-digital accelerometer
Conference paper - L.S. Pakula, V. Rajaraman, P.J. French

On the initial design and simulation of a biologically-inspired MEMS gyroscope (U_SP_2_I_IC_T)

Modelling, design and fabrication of a bio-inspired MEMS vibratory gyroscope

Design and modelling of a three mass, decoupled, tunable SOI MEMS gyroscope with sense frame architecture
Conference paper - I Sabageh, V. Rajaraman, E Cretu, P.J. French

PECVD silicon carbide surface micriomachining technology and selected MEMS applications

Fabrication of accelerometers by thin-SOI micromachining

A dome-shape bio-inspired piezoresistive MEMS strain sensor

Design of a biologically-inspired piezoresistive strain-sensing MEMS (U_SP_2_I_IC_T)

Pull in time based acceleration sensing

On integrated process development for SOI-MEMS inertial devices
Report - V. Rajaraman

Fabrication of accelerometers by thin-SOI micromachining

A versatile CMOS compatible PECVD silicon carbide MEMS technology
Conference paper - L.S. Pakula, V. Rajaraman, P.J. French

Wafer-level PECVD sic micropackaging technology for MEMS devices
Conference paper - V. Rajaraman, P.J. French

Wafer-level PECVD sic micropackaging technology for MEMS devices
Conference paper - V. Rajaraman, P.J. French

Design, modelling and fabrication of a 40-330 Hz dual-mass MEMS gyroscope on thick-SOI technology

Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide