Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects

MEMS integration techniques on silicon-on-insulator for inertial devices

Method of monolithically integrating MEMS/NEMS sensors/actuators with MEMS/NEMS sensors/actuators and example semiconductor process for making the same

A novel soi-mems ¿micro-swing¿ time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range

Design, modelling and fabrication of a 40-330 Hz dual-mass MEMS gyroscope on thick-SOI technology

PECVD silicon carbide surface micriomachining technology and selected MEMS applications

A piezoresistive detector design for a high sensitivity time based digital accelerometer

A piezoresistive detector design for a high sensitivity pull in time digital accelerometer

Design and modelling of a three mass, decoupled, tunable SOI MEMS gyroscope with sense frame architecture

Two types of silicon biomimetics MEMS gyroscopes

Pull in time based acceleration sensing

Design and modelling of a decoupled, tunable SOI-MEMS gyroscope

Design and modelling of a three mass, decoupled, tunable SOI MEMS gyroscope with sense frame architecture

Preliminary design and modeling of high performance tunable, decoupled MEMS gyroscope

Design and modeling of a three mass, decoupled, tunable SOI-MEMS gyroscope with sense frame architecture

Design and modeling of a flexible contact mode piezoresistive detector for time based acceleration sensing

Qualification of MEMS gyroscope architectures for high performance and tunability

Silicon carbide thin film encapsulation of planar thermo- electric infrared detectors for an IR microspectrometer

SOI digital accelerometer based on pull-in time configuration

Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide