Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects
Conference Paper
(2012)
Author(s)
V. Rajaraman (TU Delft - Electronic Instrumentation, TU Delft - Electronic Components, Technology and Materials)
JJ Koning (External organisation)
E Ooms (External organisation)
Grégory Pandraud (TU Delft - Electronic Components, Technology and Materials)
Kofi A. A. Kofi (TU Delft - Electronic Instrumentation)
H Boezen (External organisation)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/MEMSYS.2012.6170130
To reference this document use:
https://resolver.tudelft.nl/uuid:afa4ba5d-9e97-4f2d-9417-860486c9492b
More Info
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Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
220-223
ISBN (print)
978-1--4673-0324-8
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