Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis
Conference Paper
(2011)
Author(s)
J Tang (TU Delft - Electronic Components, Technology and Materials)
H.Y. Ye (TU Delft - Electronic Components, Technology and Materials)
JBJ Schelen (External organisation)
CIM Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ICEPT.2011.6066972
To reference this document use:
https://resolver.tudelft.nl/uuid:ed4fbdfd-7113-475c-8359-c86786f4b3c0
More Info
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Publication Year
2011
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
888-892
ISBN (print)
978-1-4577-1770-3
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