Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

Conference paper (2006)

Authors

X. Ma Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

Four types of polymer which were selected are EPNI180 and EPNI180 filled with 40%, 50% and 65% fused silica. The moisture absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions were obtained through the early stage moisture absorption tests. The moisture absorption was revealed to show the Fickian type of diffusion for four types of samples. In addition the most important issue, the relation between moisture content and filler content is discussed and is revealed. Using this relation, we can expect moisture content in the sample with different moisture contents under different temperature and relative humidity conditions. Another issue, the relation between the viscoelasticity and filler content, is revealed. We find that the filler has a great effect on the viscoelasticity. The storage modulus is increased 30% by adding 65wt% fused silica.