Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging
Conference Paper
(2010)
Author(s)
J Tang (TU Delft - Electronic Components, Technology and Materials)
JBJ Schelen (External organisation)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ICEPT.2010.5582713
To reference this document use:
https://resolver.tudelft.nl/uuid:ee3153ff-1243-4368-8daf-814677391a06
More Info
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Publication Year
2010
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1034-1038
ISBN (print)
978-1-4244-8142-2
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