Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging

Conference Paper (2010)
Author(s)

J Tang (TU Delft - Electronic Components, Technology and Materials)

JBJ Schelen (External organisation)

C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ICEPT.2010.5582713
More Info
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Publication Year
2010
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1034-1038
ISBN (print)
978-1-4244-8142-2

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