Wafer thinning for highly dense 3D electronic structures
Conference Paper
(2001)
Author(s)
L Wang (TU Delft - Electronic Components, Technology and Materials)
Pasqualina M Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:f384951d-7284-467d-92fd-0b9352e3c5ef
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Publication Year
2001
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
214-219
ISBN (print)
90-73461-29-4
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