Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures
Conference Paper
(2003)
Author(s)
H.W. van Zeijl (TU Delft - Electronic Components, Technology and Materials)
JHCM Slabbekoorn (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:fa21d45c-36eb-4303-886b-02b3427ef2fa
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Publication Year
2003
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
617-626
ISBN (print)
0-8194-4976-8
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