Silicon micromachining of high-aspect ratio, high-density through-wafer electrical interconnects for 3D multichip packaging
Journal Article
(2006)
Author(s)
L Wang (TU Delft - Electronic Components, Technology and Materials)
Pasqualina Sarro (TU Delft - Electronic Components, Technology and Materials)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Z. Wang (External organisation)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:fbdddb92-697c-4d4f-ac14-a54b2e23f64d
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Publication Year
2006
Research Group
Electronic Components, Technology and Materials
Issue number
3
Volume number
29
Pages (from-to)
615-622
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