Silicon micromachining of high-aspect ratio, high-density through-wafer electrical interconnects for 3D multichip packaging

Journal Article (2006)
Author(s)

L Wang (TU Delft - Electronic Components, Technology and Materials)

Pasqualina Sarro (TU Delft - Electronic Components, Technology and Materials)

JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)

Z. Wang (External organisation)

Research Group
Electronic Components, Technology and Materials
More Info
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Publication Year
2006
Research Group
Electronic Components, Technology and Materials
Issue number
3
Volume number
29
Pages (from-to)
615-622

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