Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Conference paper (2020)

Authors

Pan Liu Fudan University
J. Li Electronic Components, Technology and Materials - EEMCS
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2020 Pan Liu, J. Li, H.W. van Zeijl, Kouchi Zhang
DOI: https://doi.org/10.1109/ECTC32862.2020.00133
Heterogeneous integration Flexible interconnect Transferred interconnect
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Published Date

2020

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of sacrificial materials. A sacrificial layer was firstly placed on the surface of the transfer wafer, and the sandwich interconnect structures were then manufactured on top of the sacrificial layer. With the help of the sacrificial layer, the flexible interconnects were transferred to another wafer through wafer bonding process. Contact resistance structures were fabricated with the help of wafer bonding process, connecting and aligning metal contact layer on device wafer and metal layer embedded in transferred flexible interconnects. Such transferred contact resistance was measured through designed testing structures as a demo for wafer level heterogeneous integration.