Title
Photonic hybrid assembly through flexible waveguides
Author
Wörhoff, Kerstin (LioniX International BV)
Prak, Albert (LioniX International BV)
Postma, F. (LioniX International BV)
Leinse, A (LioniX International BV)
Wu, K. (TU Delft Micro and Nano Engineering)
Peters, T.J. (TU Delft Micro and Nano Engineering)
Tichem, M. (TU Delft Micro and Nano Engineering)
Amaning-Appiah, B. (Aifotec AG)
Renukappa, V. (Aifotec AG)
Vollrath, G. (Aifotec AG)
Balcells-Ventura, J. (IMST GmbH)
Uhlig, P. (IMST GmbH)
Seyfried, M. (ficonTEC Service GmbH)
Rose, D. (ficonTEC Service GmbH)
Santos, Raquel (Eindhoven University of Technology)
Leijtens, XJM (Eindhoven University of Technology)
Flintham, B. (Oclaro Technology, Inc.)
Wale, M. (Oclaro Technology, Inc.)
Robbins, D. (Willow Photonics, Ltd.)
Contributor
Vivien, Laurent (editor)
Pavesi, Lorenzo (editor)
Pelli, Stefano (editor)
Date
2016
Abstract
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.
Subject
Eutectic bonding
Flip-chip
InP
LTCC
MEMS
Photonic assembly
Photonic integrated circuit
TriPleX
To reference this document use:
http://resolver.tudelft.nl/uuid:255eb9be-f30c-48a3-8ba2-36c23c19d83f
DOI
https://doi.org/10.1117/12.2227814
Publisher
SPIE, Bellingham, WA, USA
ISBN
978-1-510601369
Source
Proceedings Silicon Photonics and Photonic Integrated Circuits V, 9891
Event
Silicon Photonics and Photonic Integrated Circuits V, 2016-04-03 → 2016-04-07, Brussels, Belgium
Series
Proceedings of SPIE, 1605-7422, 9891
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2016 Kerstin Wörhoff, Albert Prak, F. Postma, A Leinse, K. Wu, T.J. Peters, M. Tichem, B. Amaning-Appiah, V. Renukappa, G. Vollrath, J. Balcells-Ventura, P. Uhlig, M. Seyfried, D. Rose, Raquel Santos, XJM Leijtens, B. Flintham, M. Wale, D. Robbins