Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles

Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study

Li, Shizhen (Southern University of Science and Technology)
Liu, X. (TU Delft Electronic Components, Technology and Materials; Southern University of Science and Technology)
Jiang, Jing (Fudan University)
Tan, C. (TU Delft Electronic Components, Technology and Materials; Southern University of Science and Technology)
Gao, Chenshan (Chongqing University; Southern University of Science and Technology)
Liu, Yang (Harbin University of Science and Technology)
Ye, H. (Southern University of Science and Technology; Chongqing University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)

2022

Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular dynamics simulation was applied to study the thickness effect on the thermal behavior of Cu-Ag CSNPs. The melting points of CSNPs and Pure NPs can be determined by the evolutions of Potential Energy (PE), and the Lindemann index (LI) of the system. The results indicated that the melting points of CS NPs were lower than monometallic NP and the melting point of CS NP is influenced by the size of the Cu core and the number of lattice mismatches. Moreover, the distribution of atoms’ LI showed that the premelting point is independent of shell thickness. However, the fraction of atoms that occurred premelting is increased with the decrease of the shell thickness. Otherwise, we also simulated the sintering process of double CS NPs with equal size.

http://resolver.tudelft.nl/uuid:30b3f7a8-2d97-4b96-acca-d84074d2bd15

https://doi.org/10.1109/EuroSimE54907.2022.9758874

IEEE

2023-07-01

978-1-6654-5837-5

Proceedings of the 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022), 2022-04-25 → 2022-04-27, St Julian, Malta

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

conference paper

© 2022 Shizhen Li, X. Liu, Jing Jiang, C. Tan, Chenshan Gao, Yang Liu, H. Ye, Kouchi Zhang