Print Email Facebook Twitter Integrated Circuits for Miniature 3–D Ultrasound Probes Title Integrated Circuits for Miniature 3–D Ultrasound Probes: Solutions for the Interconnection Bottleneck Author Chen, Z. (TU Delft Electronic Instrumentation) Contributor Pertijs, M.A.P. (promotor) de Jong, N. (promotor) Degree granting institution Delft University of Technology Date 2020-12-21 Abstract This thesis describes low-power application-specific integrated circuit (ASIC) designs to mitigate the constraint of cable count in miniature 3-D TEE probes. Receive cable count reduction techniques including subarray beamforming and digital time-division multiplexing (TDM) have been explored and the effectiveness of these techniques has been demonstrated by experimental prototypes. Digital TDM is a reliable technique to reduce cable count but it requires an in-probe datalink for high-speed data communication. A quantitative study on the impact of the datalink performance on B-mode ultrasound image quality has been introduced in this thesis for data communications in future digitized ultrasound probes. Finally, a high-voltage transmitter prototype has been presented for effective cable count reduction in transmission while achieving good power efficiency. To reference this document use: https://doi.org/10.4233/uuid:54597354-3ebd-4bee-b5de-4a87e22bceae Part of collection Institutional Repository Document type doctoral thesis Rights © 2020 Z. Chen Files PDF Integrated_Circuits_for_M ... leneck.pdf 39.53 MB Close viewer /islandora/object/uuid:54597354-3ebd-4bee-b5de-4a87e22bceae/datastream/OBJ/view