Photolithography on bulk micromachined substrates

Title

Photolithography on bulk micromachined substrates

 Author

Venstra, W.J.
Spronck, J.W.
Sarro, P.M.
Van Eijk, J.

Faculty

Applied Sciences

 Department

Kavli Institute of Nanoscience

 Date

2009-12-31

 Abstract

Photolithography on high topography substrates, such as the sidewalls or the bottom of cavities and trenches created by bulk micromachining, enables the design of complex three-dimensional structures. When a contact lithography system is used to pattern such substrates, local gaps exist between the mask and the substrate. In this paper we investigate the deformation of patterns as a result of these local gaps. We determine the position accuracy and the minimum size of features that can be patterned as a function of the gap distance. Deformations introduced by the optical system are quantified for a common exposure tool, and compared to pattern deformation due to variations in photoresist layer thickness. Finally, methods to improve the quality of patterns transferred through gaps up to 350 ?m are discussed

 To reference this document use:

http://resolver.tudelft.nl/uuid:59203775-7650-4646-b893-1e97da569bb8

 DOI

https://doi.org/10.1088/0960-1317/19/5/055005

 Publisher

Institute of Physics

 ISSN

0960-1317

 Source

http://iopscience.iop.org/0960-1317/19/5/055005

 Source

Journal of mircomechanics and microengineering, 19 (5)

 Part of collection

Institutional Repository

 Document type

journal article

 Rights

(c)2009 The Authors; Institute of Physics
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