Print Email Facebook Twitter Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network Title Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network Author Jiang, Jing (Fudan University) Chen, Wei (Fudan University) Qian, Yichen (Hohai University) Meda, Abdulmelik H. (The Hong Kong Polytechnic University) Fan, X. (Lamar University) Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) Fan, J. (Fudan University) Date 2023 Abstract Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve superior reliability of packaging, we applied the nondominated sorting genetic algorithm with elitist strategy (NSGA-II) and ant colony optimization-backpropagation neural network (ACO-BPNN) to optimize the design of redistribution layer (RDL) in FOPLP. We first quantified the thermal resistance and thermomechanical coupling stress of the designed package under thermal cycling loading. Next, NSGA-II and ACO-BPNN were used to optimize the size of the RDL blind via. Finally, the effectiveness of the proposed reliability optimization methods was verified by performing thermal shock reliability aging tests on the prepared devices. Subject Ant Colony Neural NetworkFan-out panel-level packagingGenetic AlgorithmMOSFETPackagingPower deviceReliabilityReliability optimizationStressThermal resistanceThermal stressesThermomechanical processes To reference this document use: http://resolver.tudelft.nl/uuid:630778e8-9778-49a1-8d79-70cf5d338175 DOI https://doi.org/10.1109/TCPMT.2023.3267411 Embargo date 2023-10-09 ISSN 2156-3950 Source IEEE Transactions on Components, Packaging and Manufacturing Technology, 13 (4), 481-488 Bibliographical note Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type journal article Rights © 2023 Jing Jiang, Wei Chen, Yichen Qian, Abdulmelik H. Meda, X. Fan, Kouchi Zhang, J. Fan Files PDF Thermomechanical_Oriented ... etwork.pdf 2.42 MB Close viewer /islandora/object/uuid:630778e8-9778-49a1-8d79-70cf5d338175/datastream/OBJ/view