A combined vertical interconnect/underfill process for high density I/O flip chip bonding

Master thesis (2022)

Authors

W. jiao Electrical Engineering, Mathematics and Computer Science

Contributors

Kouchi Zhang Electronic Components, Technology and Materials - EEMCS (supervisor 1)
X. Ji Electronic Components, Technology and Materials - EEMCS (supervisor 2)
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS (supervisor 2)
Faculty
Electrical Engineering, Mathematics and Computer Science
Copyright: © 2022 weiping jiao
All-copper interconnect Photo-patternable self-aligned underfill NanoCu paste sintering Photolithographic stencil printing
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Published Date

20-10-2022

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Abstract

This thesis investigates the all-copper fine pitch bonding process with photoimageable underfill. NanoCU paste is used as interconnect material. A bi-layer photo resist structure is manufactured and lithographic stencil printing is used to apply nanoCu paste. A new underfill injection method is realized by using epoxy resin based photo resist as underfill layer. Adhesion of sample is extensively enhanced. Various bonding methods are developed including using AML bonder and Tresky pick-and-place bonder. Electrical measurements for sintered nanoCu interconnect are conducted, sheet resistance and contact resistance are studied.