Title
Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging
Author
Luo, Runding (Fudan University)
Hu, D. (TU Delft Electronic Components, Technology and Materials) 
Qian, Cheng (Fudan University)
Liu, Xu (Fudan University)
Fan, Xuejun (Lamar University College of Engineering)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials; Fudan University)
Fan, J. (TU Delft Electronic Components, Technology and Materials; Fudan University)
Date
2024
Abstract
Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and nanoflake (NF), was performed at temperatures from 500 to 650 K. Furthermore, shear and tensile simulations were conducted with constant strain rates on the sintered structure at multiple temperatures. Subsequently, the extracted mechanical properties were correlated with the sintering behavior. The results revealed that the mechanical properties of the nano-Cu sintered structure could be improved by tuning material composition and increasing the sintering temperature. We established a relationship between the sintered microstructure and mechanical response. The shear modulus and shear strength of the sintered structure with NF particles increased to 41.20 and 3.51 GPa respectively. Furthermore, the elastic modulus increased to 55.60, and the tensile strength increased to 4.88 GPa. This result provides insights into the preparation phase of nano-Cu paste for sintering technology.
Subject
Molecular dynamics (MD) simulation
Nano-Cu sintering
Nanoflake
Shear simulation
Tensile simulation
To reference this document use:
http://resolver.tudelft.nl/uuid:b58a1cfb-28b0-4faa-8906-43325f202bdf
DOI
https://doi.org/10.1016/j.microrel.2023.115284
Embargo date
2024-06-03
ISSN
0026-2714
Source
Microelectronics Reliability, 152
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
journal article
Rights
© 2024 Runding Luo, D. Hu, Cheng Qian, Xu Liu, Xuejun Fan, Kouchi Zhang, J. Fan