Title
Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study
Author
Hu, D. (TU Delft Electronic Components, Technology and Materials) 
Li, Z. (TU Delft Electronic Components, Technology and Materials)
Fan, J. (TU Delft Electronic Components, Technology and Materials; Shanghai Engineering Technology Research Center; Research Institute of Fudan University, Ningbo)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Contributor
Tay, Andrew (editor)
Chui, King Jien (editor)
Lim, Yeow Kheng (editor)
Tan, Chuan Seng (editor)
Shin, Sunmi (editor)
Date
2023
Abstract
As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for design for reliability. Both sintering and subsequent nanoindentation were studied by simulation. The effect of porosity on the nanoindentation response was investigated by setting different initial packing densities. In addition, the impact of indenter size and indentation positions on the nanoindentation response were discussed. The nanoindentation behaviors were studied by extracting loading-displacement (P-h) curves and calculating elastic modulus and hardness. In addition, the microstructure evolution was adopted using atomic configuration to study the nanoindentation mechanism. This work offers valuable insights into the Cu sinter paste preparation phase for sintering technology.
Subject
Nanoindentation
Sintering technology
Cu nanoparticles
molecular dynamics
To reference this document use:
http://resolver.tudelft.nl/uuid:d076ce95-c521-4007-b4a1-6b40b6019a2d
DOI
https://doi.org/10.1109/EPTC59621.2023.10457748
Publisher
IEEE
Embargo date
2024-09-18
ISBN
979-8-3503-2958-2
Source
Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023
Event
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023-12-05 → 2023-12-08, Singapore, Singapore
Series
Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 D. Hu, Z. Li, J. Fan, Kouchi Zhang