Title
Magnetic Coupling Based Test Development for Contact and Interconnect Defects in STT-MRAMs
Author
Yuan, S. (TU Delft Team Bart De Schutter; IMEC-Solliance)
Zhang, Z. (TU Delft Industrial Design Engineering)
Fieback, M. (TU Delft Computer Engineering) 
Xun, H. (TU Delft Computer Engineering)
Marinissen, E. J. (IMEC-Solliance)
Kar, G. S. (IMEC-Solliance)
Rao, S. (TU Delft Education and Student Affairs; IMEC-Solliance)
Couet, S. (IMEC-Solliance)
Taouil, M. (TU Delft Computer Engineering; CognitiveIC)
Hamdioui, S. (TU Delft Computer Engineering; CognitiveIC)
Faculty
Industrial Design Engineering
Date
2023
Abstract
The development of Spin-Transfer Torque Magnetic RAMs (STT-MRAMs) mass production requires high-quality test solutions. Accurate and appropriate fault modeling is crucial for the realization of such solutions. This paper targets fault modeling and test generation for all interconnect and contact defects in STT-MRAMs and shows that using the defect injection and circuit simulation for fault modeling without incorporating the impact of magnetic coupling will result in an incomplete set of fault models; hence, not obtaining accurate fault models. Magnetic coupling introduced by the stray field is an inherent property of STT-MRAMs and may foster the occurrence of additional memory faults. Not considering the magnetic coupling clearly will give rise to test escapes. The paper introduces a compact model for STT-MRAM that incorporates the intra- and inter-cell stray field, uses this model to derive the full set of fault models for interconnect and contact defects, and finally proposes an efficient test solution.
Subject
fault modeling
magnetic coupling
stray field
STT-MRAM
test development
To reference this document use:
http://resolver.tudelft.nl/uuid:159c99ea-b65c-4638-b189-cde385e71e12
DOI
https://doi.org/10.1109/ITC51656.2023.00040
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Embargo date
2024-06-30
ISBN
9798350343250
Source
Proceedings - 2023 IEEE International Test Conference, ITC 2023
Event
2023 IEEE International Test Conference, ITC 2023, 2023-10-07 → 2023-10-15, Anaheim, United States
Series
Proceedings - International Test Conference, 1089-3539
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 S. Yuan, Z. Zhang, M. Fieback, H. Xun, E. J. Marinissen, G. S. Kar, S. Rao, S. Couet, M. Taouil, S. Hamdioui