Practical aspects of thermomechanical modeling in electronics packaging

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

Ye, G. (TU Delft Electronic Components, Technology and Materials; China University of Petroleum (East China))
Fan, X. (TU Delft Electronic Components, Technology and Materials; Lamar University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)

2022

In this paper, we presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis. Firstly, for layered or patterned structures, a homogenized equivalent model, with equivalent orthotropic material properties, gives excellent agreement with the exact finite element model solutions. Such a simplified finite element model provides an efficient way for structural parameter optimization. Secondly, the finite element mesh should keep the fixed size and shape at the location of interest where the singular point exists. This approach provides a simple way for relative stress comparison in different designs, although the absolute value of stress components has no actual meaning. Thirdly, to further eliminate the mesh dependency, the volume averaging method can be used. We extended the local volume averaging method for large-area die attach problems. Fourthly, in this paper, we presented a comparison study between linear elastic and nonlinear viscoplastic analysis, and demonstrated that in some cases, two different types of analysis give opposite trend results. Lastly, we demonstrated that with the use of different stress components, the conclusions may be different. We also provided an ANSYS APDL script in the supplemental material as a benchmark example.

Finite element analysis
Homogenization
Power package
Stress singularity
Thermomechanical modeling
Volume averaging

http://resolver.tudelft.nl/uuid:1741d5e6-996c-47fb-b9a4-abfee4cabb45

https://doi.org/10.1016/j.microrel.2022.114514

2023-07-01

0026-2714

Microelectronics Reliability, 132

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Institutional Repository

journal article

© 2022 G. Ye, X. Fan, Kouchi Zhang