Print Email Facebook Twitter Characterization of thermal cross-talk in a MEMS-based thermopile detector array Title Characterization of thermal cross-talk in a MEMS-based thermopile detector array Author Wu, H. Grabarnik, S. Emadi, A. De Graaf, G. Wolffenbuttel, R.F. Faculty Electrical Engineering, Mathematics and Computer Science Department Department of ME/EI Date 2009-12-31 Abstract The spectral resolution of a MEMS-based IR microspectrometer critically depends on the thermal cross-talk between adjacent TE elements in the detector array. Thermal isolation between elements is realized by using bulk micromachining directly following CMOS processing. This paper reports on the characterization results of bridge-shaped TE detector elements that are cut out of a membrane. Elements with dimensions of 650 × 36 ?m2 are separated by 10 ?m wide gaps in order to minimize the thermal cross-talk by heat conduction through the support structure. The static and dynamic aspects of thermal cross-talk have been evaluated with an emphasis on the effect of the thermal conductivity of air as a function of the package pressure. To reference this document use: http://resolver.tudelft.nl/uuid:34835850-b0cd-4f95-9655-0c522161487e DOI https://doi.org/10.1088/0960-1317/19/7/074022 Publisher Institute of Physics ISSN 0960-1317 Source http://iopscience.iop.org/0960-1317/19/7/074022 Source Journal of micromechanics and microengineering, 19 (7) Part of collection Institutional Repository Document type journal article Rights (c)2009 The Authors; Institute of Physics Files PDF W.pdf 1.01 MB Close viewer /islandora/object/uuid:34835850-b0cd-4f95-9655-0c522161487e/datastream/OBJ/view