Combined focused electron beam-induced deposition and etching for the patterning of dense lines without interconnecting material

Combined focused electron beam-induced deposition and etching for the patterning of dense lines without interconnecting material

Hari, S. (TU Delft ImPhys/Microscopy Instrumentation & Techniques)
Trompenaars, P. H.F. (Thermo Fisher Scientific)
Mulders, J. J.L. (Thermo Fisher Scientific)
Kruit, P. (TU Delft ImPhys/Microscopy Instrumentation & Techniques)
Hagen, C.W. (TU Delft ImPhys/Microscopy Instrumentation & Techniques)

2021

High resolution dense lines patterned by focused electron beam-induced deposition (FEBID) have been demonstrated to be promising for lithography. One of the challenges is the presence of interconnecting material, which is often carbonaceous, between the lines as a result of the Gaussian line profile. We demonstrate the use of focused electron beam-induced etching (FEBIE) as a scanning electron microscope (SEM)-based direct-write technique for the removal of this interconnecting material, which can be implemented without removing the sample from the SEM for post processing. Secondary electron (SE) imaging has been used to monitor the FEBIE process, and atomic force microscopy (AFM) measurements confirm the fabrication of well separated FEBID lines. We further demonstrate the application of this technique for removing interconnecting material in high resolution dense lines using backscattered electron (BSE) imaging to monitor the process.

Focused electron beam-induced deposition
Focused electron beam-induced etching
Interconnects
Lithography
Nanopatterning
Scanning electron microscopy

http://resolver.tudelft.nl/uuid:63247334-0fef-4210-b6cd-1c2b97d0cb0a

https://doi.org/10.3390/mi12010008

2072-666X

Micromachines, 12 (1), 1-10

Institutional Repository

journal article

© 2021 S. Hari, P. H.F. Trompenaars, J. J.L. Mulders, P. Kruit, C.W. Hagen