Title
Reliability of LED-based Systems
Author
van Driel, W.D. (TU Delft Electronic Components, Technology and Materials) 
Jacobs, B.M.M. (Signify)
Watte, P. (Signify)
Zhao, X. (Signify)
Date
2021
Abstract
Reliability is an essential scientific and technological domain intrinsically linked with system integration. Nowadays, semiconductor industries are confronted with ever-increasing design complexity, dramatically decreasing design margins, increasing chances for and consequences of failures, shortening of product development and qualification time, and increasing difficulties to meet quality, robustness, and reliability requirements. The scientific successes of many micro/nano-related technology developments cannot lead to business success with-out innovation and breakthroughs in the way that we address reliability through the whole value chain. The aim of reliability is to predict, optimize and design upfront the reliability of micro/nanoelectronics and systems, an area denoted as 'Design for Reliability (DfR)'. While virtual schemes based on numerical simulation are widely used for functional design, they lack a systematic approach when used for reliability assessments. Besides this, lifetime predictions are still based on old standards assuming a constant failure rate behavior. In this paper, we will present the reliability and failures found in solid-state lighting systems. It includes both degradation and catastrophic failure modes from observation towards a full description of its mechanism obtained by extensive use of acceleration tests using knowledge-based qualification methods.
To reference this document use:
http://resolver.tudelft.nl/uuid:813aec1f-2718-4cd1-85ac-9a1f17fe803f
DOI
https://doi.org/10.1109/EuroSimE52062.2021.9410861
Publisher
IEEE
Embargo date
2021-10-31
ISBN
9781665413732
Source
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Event
22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, 2021-04-19 → 2021-04-21, St. Julian, Malta
Series
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2021 W.D. van Driel, B.M.M. Jacobs, P. Watte, X. Zhao