Print Email Facebook Twitter Technology platform for advanced neurostimulation implants Title Technology platform for advanced neurostimulation implants: The “chip-in-tip” DBS probe Author Kluba, M.M. (TU Delft Electronic Components, Technology and Materials) Contributor Dekker, R. (promotor) Degree granting institution Delft University of Technology Date 2022-01-31 Abstract The progress in the field of neurostimulation is impressive, both from a technical as well as from a therapeutic point of view. Nowadays, the electrical stimulation of the nervous system can be used to induce or suppress muscle responses. Additionally, it can also influence hearing, vision, immune system response, pain perception, and even mental state. The number of medical conditions that can be treated using existing or completely new neurostimulation devices is continuously growing. Moreover, well-targeted electrical neuromodulation can help reduce the whole-body side effects, typical for traditional medication therapies. However, the potential of neurostimulation therapy is limited by the relatively slow development of the accompanying technologies. Most commercial neurostimulation implants still consist of a pulse generator encapsulated in a bulky titanium case and lengthy extension cords. Moreover, in some cases, such as deep brain stimulation (DBS), the resolution of the stimulation is also an issue that can cause severe side effects. In this thesis work, a technology platform for the manufacturing and packaging of advanced neurostimulation implants has been developed to enable further bioelectronics miniaturization and improve the stimulation resolution. These goals have been achieved in close collaboration with the InForMed project partners involved in finalizing the joint design, preparing the inter-facility fabrication process, and supplying off-the-shelf technology modules… Subject neurostimulationdirectional deep brain stimulatorminiaturizationhigh-level integrationtrench capacitorhigh-definition flex-to-rigidsealable trenchescavity-BOXbiocompatible flip-chipflexible interconnectssoft encapsulationparyleneplatinumceramicsparylene processing in cleanroom To reference this document use: https://doi.org/10.4233/uuid:9dd9701b-343e-4f25-8d49-02652e839e32 ISBN 978-94-6384-296-9 Part of collection Institutional Repository Document type doctoral thesis Rights © 2022 M.M. Kluba Files PDF DissertationV2_MM_Kluba.pdf 18 MB PDF Propositions_MM_Kluba.pdf 179.5 KB Close viewer /islandora/object/uuid:9dd9701b-343e-4f25-8d49-02652e839e32/datastream/OBJ1/view