Print Email Facebook Twitter Warpage analysis on power module ceramic substrates Title Warpage analysis on power module ceramic substrates Author Wang, Chieh (TU Delft Electrical Engineering, Mathematics and Computer Science) Contributor Poelma, René H. (mentor) Hu, D. (mentor) Zhang, Kouchi (mentor) Manzaneque Garcia, T. (graduation committee) Degree granting institution Delft University of Technology Programme Electrical Engineering Date 2023-08-31 Abstract This study deals with the challenge of warpage in power modules, vital components in the rapidly expanding electric and hybrid-electric vehicle industry. The variations in temperature during manufacturing, resulting in significant warpage changes, contribute to device cracks, delamination, and reduced reliability.The primary focus is understanding and mitigating the warpage phenomenon in power module substrates. This warpage is induced by thermo-mechanical stresses during the assembly packaging process. The investigation begins by exploring the cause of warpage change by characterizing annealed copper properties and employing 2D finite element model (FEM) analysis. The study identifies plastic strain as the dominant cause of warpage change during process steps. Subsequently, a validated 3D FEM simulation model is developed to replicate practical annealing and sintering processes. Lastly, the project delves into factor analysis to identify critical variables influencing warpage. It underscores that balancing residual copper volume is crucial in warpage reduction. Additive and subtractive manufacturing techniques establish a correlation between the removal of copper volume and warpage reduction.This project provides comprehensive insights into the manufacturing process of AMB substrate, warpage behavior, and effective strategies for reduction, constructing a solid foundation for future manufacturing and design. Subject Power modulesAMB substrateWarpageFinite element modelSinteringAdditive technologySubtractive technology To reference this document use: http://resolver.tudelft.nl/uuid:e82c0398-eda2-4dd4-95cb-3137fc4dc91e Embargo date 2025-08-31 Part of collection Student theses Document type master thesis Rights © 2023 Chieh Wang Files file embargo until 2025-08-31