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Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint
Unsupervised Feature Transfer for Batch Process Based on Geodesic Flow Kernel
Stability Analysis of Unsaturated Soil Slope Considering the Variability of Soil-water Characteristic Curve
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