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Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
Reliability improvement of the dredging perception system: A sensor fault-tolerant strategy
Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures
Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation
Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore
Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
Assessment of Vigilance Level during Work: Fitting a Hidden Markov Model to Heart Rate Variability
A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
Effects of GBFS content and curing methods on the working performance and microstructure of ternary geopolymers based on high-content steel slag
Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules
Plot-level reconstruction of 3D tree models for aboveground biomass estimation
Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition
Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study
Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations
Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
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