Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Chen, Wei; Liu, Xu; Hu, D.; Liu, X.; Zhu, Xi; Fan, Xuejun; Zhang, Kouchi; Fan, J.

doi:10.1016/j.matdes.2024.112702

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Title

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Author

Chen, Wei (Fudan University)
Liu, Xu (Fudan University)
Hu, D. (TU Delft Electronic Components, Technology and Materials)
Liu, X. (TU Delft Electronic Components, Technology and Materials)
Zhu, Xi (Fudan University; Research Institute of Fudan University, Ningbo)
Fan, Xuejun (Lamar University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Fan, J. (TU Delft Electronic Components, Technology and Materials; Fudan University; Research Institute of Fudan University, Ningbo)

Date

2024

Abstract

During operation in environments containing hydrogen sulfide (H₂S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and mechanism of H₂S-induced corrosion of sintered nanoCu, and bulk Cu was used as the reference. The following results are obtained: (1) Both sintered nanoCu and bulk Cu reacted with O₂ prior to reacting with H₂S, forming Cu₂O, Cu₂S, CuO, and CuS. In addition, sintered nanoCu exhibited more severe corrosion. (2) For both sintered nanoCu and bulk Cu, H₂S-induced corrosion resulted in the deterioration of electrical, thermal, and mechanical properties, and sintered nanoCu experienced a greater extent of deterioration. (3) As was ascertained through Reactive Force Field (ReaxFF) MD simulations, the penetration of H₂S and O₂ combined with the upward migration of Cu resulted in the formation of a corrosion film. In addition, compared to bulk Cu, the H₂S and O₂ penetration in the sintered nanoCu structure was observed to occur to a greater depth, accounting for the more pronounced performance degradation.