Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation

FedKNOW: Federated Continual Learning with Signature Task Knowledge Integration at Edge

Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

Stability Analysis of Triple Active Bridge Converter with Hybrid Loads and Different Control Strategies

Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation

EdgeVisionBench: A Benchmark of Evolving Input Domains for Vision Applications at Edge

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

Review of Laser Sintering of Nanosilver Pastes for Die Attachment: Technologies and Trends

Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition

A 2m-Range 711uW Body Channel Communication Transceiver Featuring Dynamically-Sampling Bias-Free Interface Front End

Case-driven category analysis of 3D building property

Potential application of MSWI bottom ash as substitute material in Portland cement concrete: Filler or binder

Effect of CA bacteria on the carbonation process of γ-C2S

Hydration behaviour of magnesium ammonium phosphate cement and stability analysis of its hydration products through thermodynamic modelling

Predicting the yield stress of 3D printing mortar based on the flowability of paste and excess paste thickness

Potential application of MSWI bottom ash as substitute material in Portland cement concrete: Filler or binder

Pre-Treatments Of Mswi Bottom Ash For The Application As Supplementary Cementitious Material In Blended Cement Paste

Relaxing the control-gain assumptions of DSC design for nonlinear MIMO systems

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages