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Martin, H.A. (author), Reintjes, Marcia (author), Reijs, Dave (author), Dorrestein, Sander (author), Kengen, Martien (author), Libon, Sebastien (author), Smits, Edsger (author), Tang, Xiao (author), Koelink, Marco (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the...
conference paper 2023
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...
conference paper 2022