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High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
Stress analysis of pressure-assisted sintering for the double-side assembly of power module
Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
Combined effect of hysteresis and heterogeneity on the stability of an embankment under transient seepage
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