Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...

Relaxing the control-gain assumptions of DSC design for nonlinear MIMO systems

This work focuses on adaptive neural dynamic surface control (DSC) for an extended class of nonlinear MIMO strict-feedback systems whose control gain functions are continuous and possibly unbounded. The method is based on introducing a compact set which is eventually proved to be an invariant set: thanks to this set, the restrictive...