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Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition
Using Mixed Incentives to Document Xi’an Guanzhong
Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
Research on preparation and properties of C-S-H /PEG1000 phase change composite
AlGaN/GaN HEMT micro-sensor technology for gas sensing applications
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