Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Effects of natural and thermal oxidation on electronic and optical properties of monolayer WS2: a theoretical study

Warpage deformation analysis of AMB ceramic substrates in power modules

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

23.3 A 51A Hybrid Magnetic Current Sensor with a Dual Differential DC Servo Loop and 43mA_rmsResolution in a 5MHz Bandwidth

3.1 A 120.9dB DR, -111.2dB THD+N Digital-Input Capacitively-Coupled Chopper Class-D Audio Amplifier

A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation

A Class-D Piezoelectric Speaker Driver Using A Quadrature Feedback Chopping Scheme achieving 29dB Large-Signal THD+N Improvement

Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect

Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

Machine learning assisted early anomaly detection of LEDs with spectral power distribution modeling

Effect of Thermomigration on Electromigration in SWEAT Structures

Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Temperature Field Simulation and optimization for Horizontal 6-inch 4H-SiC Epitaxial CVD Reactor by Induction Heating

Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

Implementation of Fully Coupled Electromigration Theory in COMSOL

Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition

Research on Thermal-Mechanical Properties of GaN Power Module Based on QFN Package by Using Nano Copper/Silver Sinter Paste