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Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
Multi-parameters optimization for electromigration in WLCSP solder bumps
Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures
Automated surface melt detection over the Antarctic from Sentinel-1 imagery using deep learning
A Fully Integrated Sequential Synchronized Switch Harvesting on Capacitors Rectifier Based on Split-Electrode for Piezoelectric Energy Harvesting
A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques
Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
A Markov chain-based approach for assessing respiratory infection risk in a multi-zone office building
Hierarchical Motion Planning and Tracking for Autonomous Vehicles Using Global Heuristic Based Potential Field and Reinforcement Learning Based Predictive Control
Speed and heading control-based collision avoidance for a ship towing system
Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method
Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices
High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material
High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling
Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration
Reviving the rock-salt phases in Ni-rich layered cathodes by mechano-electrochemistry in all-solid-state batteries
A Crystal-Less Clock Generation Technique for Battery-Free Wireless Systems
Flexible Collision-free Platooning Method for Unmanned Surface Vehicle with Experimental Validations
A 2m-Range 711uW Body Channel Communication Transceiver Featuring Dynamically-Sampling Bias-Free Interface Front End
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