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Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
Experimental Validation of Torque-Based Control for Realistic Handwheel Haptics in Driving Simulators
In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics
Analysis of the European results on the HTTR's core physics benchmarks
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