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Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules
Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
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